Automated fillet inspection system with closed loop feedback and methods of use

ABSTRACT

Systems and methods for automated inspection of fillet formation along on or more peripheral edges ( 13   a ) of a packaged microelectronic device ( 14 ) that is attached to a supporting substrate ( 16 ), such system ( 10 ) including a feedback loop for controlling fillet formation More specifically, the system ( 10 ) includes a dispensing system ( 18 ) configured for dispensing underfill material ( 22 ) onto the supporting substrate ( 16 ) The system ( 19 ) further includes an automated optical inspection (AOI) system ( 19 ) configured for determining a value of a measurable attribute of the fillet ( 12 ), such as whether the fillet ( 12 ) is properly dimensioned, i e, sized and shaped A feedback loop ( 66 ) is included between the dispensing system ( 18 ) and automated optical inspection system ( 19 )

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.61/079,547, filed Jul. 10, 2008, the disclosure of which is herebyincorporated by reference herein in its entirety.

BACKGROUND

The present invention relates generally to an automated system forinspecting and controlling fillet formation, and more specifically to asystem and method for inspection of fillet formation along an edge(s) ofa packaged microelectronic device, which is attached to a supportingsubstrate.

In the semiconductor industry, fillet may be found along one or moreedges, including corners, of a packaged microelectronic device, e.g., aball grid array (BGA), chip scale package (CSP), or flip chip, which isattached to a supporting substrate, e.g., a printed circuit board (PCB),via known dispensing processes. The fillet is an attribute of anunderfill material that is incorporated into the assembly of thepackaged microelectronic device and supporting substrate to add strengthto the mechanical connections and to protect against environmentaldamage.

In one example, a defined amount of a curable underfill material, suchas an epoxy, is dispensed from a dispensing device along one or moreedges of a rectangular-shaped packaged microelectronic device, which hasbeen previously soldered with solder bump interconnections or anothertype of attachment to a PCB. By capillary action, the material is drawninto the gap underneath the packaged microelectronic device and, as itflows outward to the other edges of the packaged microelectronic device,underfills the packaged microelectronic device, i.e., fills the gapbetween the packaged microelectronic device and the PCB. The fillet isformed around the packaged microelectronic device, which extends fromthe sides of the packaged microelectronic device to the PCB. In otherwords, the fillet is not under the packaged microelectronic device butforms along the edges of the packaged microelectronic device. Theunderfill material is eventually cured, typically thermally cured byheating, after fillet formation. The fillet may be uniform, or not, andmay be further enhanced by a secondary dispensing process known in theart as a “seal pass”.

In another example, the dispensing process utilizes edge or corner bonddispensing of curable underfill material to form fillets known in theart, respectively, as edge bonds or corner bonds. In this process, thefillet is directly formed along one or more, or a portion of, the edges,including the corners, of the packaged microelectronic device, withoutunderfilling the space between the packaged microelectronic device andsupporting substrate. With corner bond dispensing, the dispensedmaterial may only partially flow under the packaged microelectronicdevice to provide bonding. Again, the underfill material is eventuallycured after fillet formation.

A fluxing or “no-flow” underfill process is yet another technique forforming fillets. In this process, underfill material is first dispensedon a supporting substrate's solder pads, then a packaged microelectronicdevice is placed on top of the underfill material. As the packagedmicroelectronic device is forced down onto the corresponding solderpads, the packaged microelectronic device displaces the underfillmaterial. Excess material forms a fillet along the edges of the packagedmicroelectronic device. This assembly is then put through an oven thatreflows the solder to attach the packaged microelectronic device to thesupporting substrate and cure the underfill material at the same time.

The resulting assembly may be subjected to shock, vibration, thermalcycling, or other environmental stresses in its intended use. Theunderfill material, which includes the corner bond material, in each ofthe above processes helps improve the reliability and operationallongevity of the resulting assembly.

Numerous variables that can affect fillet formation. The variables caninclude, for example, the viscosity, surface tension, volume, and/ortemperature of the underfill material, as well as the surfacecharacteristics and temperature of the packaged microelectronic deviceand supporting substrate. Those variables can be inter-dependent, e.g.,temperature affects viscosity, and/or dynamic, i.e., change over time.Because precise control of the variables can be difficult to obtain,quality and consistency of the underfill dispensing process, likewise,can be difficult to achieve, as well as sustain once so achieved.

Conventional methods of monitoring fillet formation involve humaninspection of the resulting fillet. For example, in one instance, thehuman inspector simply observes the size and shape of the fillet formedalong the edge(s) of the packaged microelectronic device that isattached to the supporting substrate to determine whether the fillet isproperly dimensioned. If the fillet is improperly dimensioned, theoperating parameters of the underfill dispensing process, e.g., thetemperature of the supporting substrate or amount of the underfillmaterial, can be adjusted accordingly to change the fillet size and/orshape. Unfortunately, manual inspection exhibits numerous limitations.For example, the subjectivity of evaluating whether the fillet isproperly dimensioned varies from operator to operator. In addition,traceability make be lacking for the manual inspection process.

It would thus be beneficial to provide an improved system and method forinspecting and controlling fillet formation that overcomes theaforementioned drawbacks.

SUMMARY

In one embodiment, an automated system is provided for use in analyzinga material dispensed onto a supporting substrate. The system includes adispensing system and an automated optical inspection system. Thedispensing system has a dispensing device configured to dispense thematerial onto the supporting substrate. The automated optical inspectionsystem is configured to capture an image of the material and to analyzethe image to determine a value of a measurable property of the dispensedmaterial. A feedback loop couples the automated optical inspectionsystem with the dispensing system. The automated optical inspectionsystem is configured to communicate the value of the measurable propertyof the material dispensed at the peripheral edge of the gap over thefeedback loop to the dispensing system.

In another embodiment, a method is provided for use in analyzing amaterial dispensed onto a supporting substrate. The method includesdispensing the material onto the supporting substrate and thentransferring the supporting substrate and the dispensed material fromthe dispensing system to an automated optical inspection system. Theautomated optical inspection system is used to determine a value of ameasurable property of the dispensed material, which is communicatedfrom the automated optical inspection system to the dispensing system.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate embodiments of the invention and,together with a general description of the invention given above, andthe detailed description of the embodiments given below, serve toexplain the principles of the invention.

FIG. 1 is a diagrammatic view of an automated system for inspecting andcontrolling fillet formation in accordance with an embodiment of theinvention.

FIG. 1A is a diagrammatic view similar to FIG. 1 of an automated systemfor inspecting and controlling fillet formation in accordance withanother embodiment of the invention.

FIG. 1B is a diagrammatic view similar to FIGS. 1 and 1A of an automatedsystem for inspecting and controlling fillet formation in accordancewith yet another embodiment of the invention.

FIG. 2 is a side elevation view of a packaged microelectronic device andsupporting substrate showing the packaged microelectronic deviceattached thereto.

FIG. 3 is a perspective view of a portion of a dispensing devicedispensing material along an edge of the packaged microelectronic deviceof FIG. 2 via an underfill dispensing process so as to form a fillet.

FIG. 3A is a side elevation view illustrating fillet formation in ano-flow dispensing process.

FIG. 3B is an enlarged view of a semiconductor and supporting substrateassembly showing a corner bond with no fillet formation formed viacorner bond dispensing.

FIG. 4 is a diagrammatic view of the automated optical inspection systemof FIG. 1 used to inspect the fillet formed as in FIG. 3 and interfacedwith the dispensing system in accordance with an embodiment of theinvention.

DETAILED DESCRIPTION

With reference to FIGS. 1-4 and in accordance with an embodiment of theinvention, an automated system 10 is configured to inspect and controlthe formation of a fillet 12. A packaged microelectronic device 14 isdirectly mounted to a supporting substrate 16. The fillet 12 is formedalong one or more peripheral edges 13 a and 13 b of the packagedmicroelectronic device 14 via a dispensing process, e.g., an underfilldispensing process, as described below. In one example, the packagedmicroelectronic device 14 can be a surface mount package such as a ballgrid array (BGA), a chip scale package (CSP), or a flip chip, and thesupporting substrate 16 may be a printed circuit board (PCB). Thepackaged microelectronic device 14 can include one or more semiconductorchips or die, an interposer substrate or lead frame attached to the die,a molded outer casing encapsulating the die, and external connectionsfor coupling the die with the supporting substrate 16. The packaging ofthe packaged microelectronic device 14 protects the die fromenvironmental and handling hazards and permits the die inside thepackaged microelectronic device 14 to be electrically and mechanicallyattached to the supporting substrate 16.

In the representative embodiment, the automated system 10 includesdispensing system 18 that performs an underfill dispensing process. Thedispensing system 18 includes a controller 36 and a dispensing device 21that operates under the control of control signals supplied by thecontroller 36. The dispensing device 21 includes a dispensing nozzle 20(shown in partial) used to dispense an underfill material 22 that mayinfiltrate and fill a gap 24 between the packaged microelectronic device14 and the supporting substrate 16 by capillary action.

In one embodiment, the dispensing device used in the dispensing system18 may be a “jetting” dispenser commonly used in the electronicsindustry to selectively dispense small amounts or droplets of a highlyfluid material in a non-contact manner onto a substrate like supportingsubstrate 16. One type of jetting dispenser includes a valve seatsurrounding a discharge passage and a needle having a tip that isconfigured to move relative to the valve seat. When the tip of theneedle is in contact with the valve seat, the discharge passage isisolated from a chamber supplied with pressurized fluid material. Todispense droplets of the fluid material from the jetting dispenser indispensing system 18, the tip of the needle is lifted from the valveseat so that a small amount of the fluid material flow from the chamberthrough the valve seat to the discharge passage. The tip of the needleis then moved rapidly toward the valve seat to close the flow path andtransfer momentum to the fluid material in the discharge passage causesa droplet of the material to be ejected, or “jetted,” from an outlet ofthe discharge passage. The droplet, which contains a small discretevolume of the fluid material, travels with a ballistic trajectory andeventually lands at a specified location on the circuit board.

The jetting dispenser of the dispensing system 18 is configured to “fly”above the supporting substrate 16 at a fixed height and to jet thematerial onto an intended application area in a non-contact manner. Tothat end, the jetting dispenser of the dispensing system is typicallymoved by a robot (not shown) in a pattern across a surface of thesupporting substrate 16. By rapidly jetting the material “on the fly”(i.e., while the jetting dispenser is in motion) under the control ofcontroller 36, the dispensed droplets may be joined to form a continuousline. Consequently, such jetting dispensers may be readily programmedfor use in the dispensing system 18 to dispense desired patterns of afluid material, such as underfill.

Prior to receipt for processing by the automated system 10, the packagedmicroelectronic device 14 and supporting substrate 16 are pre-assembled,e.g., soldered together, thereby forming gap 24 therebetween, as bestshown in FIG. 2. In one embodiment, the packaged microelectronic device14 is attached to the supporting substrate 16 by bumping the packagedmicroelectronic device 14 with solder bump interconnections. To bump thechip, the bottom surface of the packaged microelectronic device 14 canbe coated with regions of underbump metal (UBM) to enhance theelectrical connection, to protect the packaged microelectronic device 14from the bump materials, and to define the bump size and location. Thesolder bump interconnections, which mechanically attach the packagedmicroelectronic device 14 to the supporting substrate 16, also provideelectrically conductive paths for power and signals and thermallyconductive paths to dissipate heat generated when the packagedmicroelectronic device 14 is operating. Heating the assembly of thepackaged microelectronic device 14 and supporting substrate 16 in anoven 27, e.g., a reflow oven, melts the solder, which acts to connectthe packaged microelectronic device 14 and the supporting substrate 16when solidified.

The assembly consisting of the packaged microelectronic device 14 andsupporting substrate 16 is fed into dispensing system 18 from suitableupstream equipment 26. The upstream equipment 26 can include a loaderknown in the art, such as an in-line conveyer system or an automatedloader that transfers or feeds the packaged microelectronic device 14and supporting substrate 16 into the dispensing system 18 via cassettescontaining the packaged microelectronic device 14 and supportingsubstrate 16. Alternatively, the upstream equipment 26 may include theoven 27, as well as the loader.

Once situated within the dispensing system 18, the pre-assembledpackaged microelectronic device 14 and/or supporting substrate 16 can bepre-heated via a heating device 29, as known to a person having ordinaryskill in the art. After pre-heating, the position of the assembly in thedispensing system 18 may be evaluated before dispensing the underfillmaterial 22. Alternatively, the assembly of the packaged microelectronicdevice 14 and supporting substrate 16 may be pre-heated in the oven 27.

As shown in FIG. 3, the underfill material 22 is dispensed from thedispensing device 21 along at least one of the peripheral edges 13 a ofthe packaged microelectronic device 14 so as to fill the gap 24 (FIG. 2)by capillary flow and, thus, form the fillet 12 (FIG. 4). The peripheraledges 13 a at which dispensing is performed under the control ofcontroller 36 may be referred to as the dispensing peripheral edges. Asearlier explained, by capillary action, the dispensed material 22 isdrawn underneath the packaged microelectronic device 14 and fills thegap 24 as it flows outward to the non-dispensing peripheral edge(s) 13b, or flow-out edges, of the packaged microelectronic device 14. Asingle pass or multiple passes may occur along dispensing peripheraledge 13 a, which may define an I-shape. Dispensing also may occur alongmultiple peripheral edges 13 a, 13 b so as to define an L-pass shape,for example. In addition, after the gap 24 has been filled, an optionalseal pass (not shown) may be applied around the material 22 at thedispensing peripheral edges 13 b so as to finish the fillet 12 (FIG. 4).Any material suitable for filling the gap and forming the fillet 12 maybe utilized. In one example, the underfill material 22 is a curablenon-conductive polymeric material such as an epoxy. The underfillmaterial 22 may comprise one or more polymerizable monomers,polyurethane prepolymers, block copolymers, and radial copolymers, aswell as substances like initiators, catalysts, cross-linking agents,stabilizers, and the like. When cured and hardened, such polymericmaterials 22 contain molecules that are chained or cross-linked to forma strongly bonded mass.

Alternatively, the dispensing system 18 may also provide corner or edgebond dispensing wherein the material 22 only forms fillet 12 atperipheral edge 13 a, or one or more corners 31, without underfillingthe gap 24 beneath the packaged microelectronic device 14. In the caseof corner or edge bond dispensing, the dispensing of the material 22 canoccur along one or more of the edges 13 a, 13 b, or corners 31, or aportion thereof to form fillet 12. And, with corner bond dispensing, thepackaged microelectronic device 14, as shown in FIG. 3B, may have one ormore corner bonds 28 and no fillet formation.

After the material 22 has been dispensed, the packaged microelectronicdevice 14 and supporting substrate 16 carrying the material 22 formingfillet 12 may be heated via a heating device so that the material 22 canjellify. Jellification helps stabilize the material 22 so that thepackaged microelectronic device 14 and supporting substrate 16 can behandled before evaluation at the AOI system 19. In some cases, thestability of the material 22 may suffice for inspection such that thematerial 22 does not have to be first jellified.

With reference to FIGS. 1A and 3A in which like reference numerals referto like features in FIGS. 1-3 and in accordance with an alternativeembodiment, the dispensing system 18 of the automated system 10 isconfigured to utilize a no-flow underfill dispensing process. Thedispensing system 18 includes a dispensing device similar to dispensingdevice 21 that dispenses the material 22 onto solder pads (not shown) ofthe supporting substrate 16. The material 22 for the no-flow processgenerally includes fluxing and epoxy characteristics. After dispensing,the supporting substrate 16 with material 22 is transported, such as viaa conveyor assembly, from the dispensing system 18 to the pick and placemachine 30. At the pick and place machine 30, the packagedmicroelectronic device 14 is placed on top of the underfill material 22.Any suitable pick and place machine 30, as is known to a person havingordinary skill in the art, may be utilized to perform this operation.The packaged microelectronic device 14 displaces the material 22 as thepackaged microelectronic device 14 is forced down onto the supportingsubstrate 16 by the pick and place machine 30. The excess displacedmaterial forms the fillet 12 along the edges 13 b of the packagedmicroelectronic device 14. The assembly of packaged microelectronicdevice 14 and supporting substrate 16 with fillet 12 is then transportedfrom the pick and place machine 30 to the AOI system 19, as furtherdescribed below.

With reference to FIG. 1B in which like reference numerals refer to likefeatures in FIGS. 1-3 and in accordance with an alternative embodiment,the dispensing system 18 and the AOI system 19 of the automated system10 may be combined into a single chassis. In this combined machineformat, the controllers 36, 50 are linked by the feedback loop 66, asfurther described below. In certain embodiments, the controllers 36, 50may be merged into a single controller that has the functionality of theindividual controllers. In this instance, the assembly of the packagedmicroelectronic device 14, supporting substrate 16, and material 22 maybe transported internally to the chassis from a location suitable fordispensing the material 22 to a different location suitable forinspecting the dispensed material 22, or the dispensing and inspectionlocation may be shared such that the assembly is stationary during theseoperations or merely moved over a minor distance to accommodate accuratedispensing and imaging.

As one example of a suitable dispensing system 18, the Axiom series,such as the Axiom X-1020 Dispensing System, available from Asymtek ofCarlsbad, Calif., may be utilized in embodiments of the presentinvention.

As earlier mentioned, a number of variables that can affect the fillet12 (FIG. 4) formed from the dispensing process can include, for example,the viscosity, surface tension, volume, and/or temperature of thematerial 22, as well as the surface characteristics or temperature ofthe packaged microelectronic device 14 and supporting substrate 16. Thedispensing system 18 generally includes one or more software featurescapable of controlling certain of the various variables, e.g., volume oramount dispensed and temperature of the supporting substrate, andconsequently underfill material 22 after it is dispensed. So as to yieldproperly dimensioned fillets 12, operating parameters for the underfilldispensing system 18 are defined that take into consideration thedifferent variables that can affect the fillet 12, as well as thedesired size and shape, e.g., length, width, and height, of the fillet12. With operating parameters established, the AOI system 19, which isfurther discussed below, provides automated analysis of the fillet 12 sothat those operating parameters can be monitored and the properdimensions of the fillet 12 maintained. As a result, the quality andconsistency of the underfill dispensing process may be maintained inreal-time. In particular, the AOI system 19 can send, or feed,information directly back to the dispensing system 18 and the dispensingsoftware can adjust the dispensing parameters, such as volume ofmaterial 22, to correct the size of the fillet 12.

With further reference to FIGS. 1, 1A, 3, 3A, and 4, the packagedmicroelectronic device 14 and supporting substrate 16 with fillet 12next move directly from the underfill dispensing system 18, or directlyfrom the pick and place machine 30 in the case of no-flow dispensing, tothe AOI system 19, which is configured for determining whether thefillet 12 is properly dimensioned. The systems 10 of FIGS. 1 and 1A maydefine an “island of automation” or an inline system, as are known inthe art. Generally, an island of automation represents a single roboticsystem, or other automatically operating machine, that functionsindependently of any other machine or process. An inline system is anarrangement of equipment in which the product being assembled passesconsecutively from operation to operation until completed. Accordingly,the AOI system 19 and dispensing system 18 may be contained in theisland of automation, or alternately, the AOI system 19 and dispensingsystem 18 may be considered to be arranged inline relative to eachother. In either the inline or island of automation arrangement, the AOIsystem 19 of FIGS. 1 and 1A may be configured to transport the assemblyof packaged microelectronic device 14 and supporting substrate 16 withfillet 12 from the dispensing system 18 or pick and place machine 30,respectively, via a substrate conveyer sub-assembly 34. Alternatively,the dispensing system 18, or pick and place machine 30, may utilizeloaders (not shown) and unloaders (not shown) to pass cassettes, whichinclude the packaged microelectronic device 14 and supporting substrates16 with fillets 12, to the AOI system 19.

With specific reference now to FIG. 4, the AOI system 19 generallyincludes a lighting sub-system 40 having at least one light source thatdirects visible light, e.g., white and/or multi-color light, onto thefillet 12 to produce a natural image thereof. The lighting sub-system 40is able to illuminate the fillet 12 under computer control. The lightsource can be used in fiducial alignment, barcode reading, or opticalcharacter recognition (OCR) of the device. Barcode or OCR may bedesirable to provide traceability for the process.

The AOI system 19 further includes a camera sub-system 46, which has atleast one camera with optics, e.g., a lens, positioned to capture one ormore images of the fillet 12 when light is emitted thereon from thelighting sub-system 40. The camera 46 is depicted in the representativeembodiment as being situated directly above the packaged microelectronicdevice 14 to capture one or more images of the fillet 12. However, itshould be understood that more than one camera 46 may be provided atvarious positions to capture images of the fillet 12, including thevarious edges 13 a, 13 b thereof. The captured images are conveyed to acontroller 50, which may have the representative form of animage-processing computer, for determining the size and shape of thefillet 12, i.e., whether the fillet 12 is properly dimensioned. The sizeand shape of the fillet 12 are compared against targeted orpre-determined values of size and shape as a standard to determinewhether the underfill dispensing system 18 is operating effectively andwhether any of the operating parameters thereof need to be adjusted.

The AOI system 19 also includes the substrate conveyor sub-system 52,for conveying the supporting substrate 16 from the dispensing system 18(or pick and place machine 30) and holding the supporting substrate 16during inspection of the fillet 12. In place of the substrate conveyorsub-system, a loader (not shown) may be utilized to place the packagedmicroelectronic device 14 and supporting substrate 16 with fillet 12onto a substrate holder sub-system (not shown). The substrate holdersub-system can support the supporting substrate 16 from below by usingsupport pins, for example, configured to securely situate the supportingsubstrate 16.

A transport mechanism 56, which can also be included as part of the AOIsystem 19, includes an XY-axis motor, which is connected to and movesthe camera to aid in inspection of the fillet 12. Other options arecontemplated including but not limited to incorporation of Z-axismovement, as desired.

The controller 50 of the AOI system 19 is coupled with the camerasub-system 46, as well as with a motion controller 60 for providingmovement commands to the XY motor of the transport system 56. Thecoupling may rely on optical signals or electrical signals to, forexample, communicate a representation of an image from the camera of thecamera sub-system 46 to the controller 50. The controller 50 includesone or more software programs capable of executing machine visionalgorithms for evaluating the shape and size of the fillet 12 asdepicted in the captured images. A user interface with the AOI system 19may be include a computer monitor, keyboard, and/or mouse, depictedgenerally as reference numeral 62, which are operatively linked with thecontroller 50.

One such AOI system 19 that may be utilized to perform automatedinspection of the fillet 12 is the YTV Series AOI, such as the F or MSeries, available from YESTech Inc. of San Clemente, Calif.

The inspection program for the AOI system 19 generally starts with aproperly dimensioned fillet as a comparative standard. The filletdimensions may be manually entered into the AOI system 19 or the fillet12 can be automatically inspected by the AOI system 19 so that theimage-processing software can train itself. Once the fillet dimensionsare input and/or the learning process has been accomplished, automatedinspection of fillets 12 can occur within the AOI system 19. Fiducialalignment is typically performed as part of the inspection process. Inaddition, the inspection process may be many times faster than thedispensing process. For example, inspection speed may be around 1 squareinch per second, and 20 to 30 seconds for the fillet 12, whereasdispensing of the fillet material 22 for the fillet 12 may take up to 5minutes. Thus, in one representative embodiment, the entire fillet,e.g., all four edges 13 a, 13 b of the fillet 12, may be completelyinspected. In another representative embodiment, only the shape and sizeof the fillet 12 at one or more of the flow-out edges 13 b is inspected.

The automated system 10 includes a feedback loop 66 for closed loopcontrol of a dispensing system 18 by measurements made by an automatedoptical inspection (AOI) system 19. The feedback loop 66 promotescontrol over fillet formation at the dispensing system 18, i.e.,maintain a desired size and shape of the fillet 12. The feedback loop 66associates, or connects, the controller 36 at the dispensing system 18and the controller 50 at the AOI system 19 so that information can bebidirectionally exchanged between the AOI system 19 to the dispensingsystem 18 or unidirectionally communicated from the AOI system 19 to thedispensing system 18. The exchanged or communicated information may be,for example, values of a measurable property of the fillet material 22,such as shape, dimensions, or another attribute, determined at the AOIsystem 19. The values of the measurable property are typically numericalbut, in an alternative embodiment, may be qualitative.

Suitable interfacing to provide the feedback loop 66 may be accomplishedby networking the two systems 18, 19 using known techniques. Thefeedback loop 66 coupling the controller 36 at the dispensing system 18with the controller 50 at the AOI system 19 may include a communicationslink, e.g., a cable, and an algorithm executing on the dispensing system18 to facilitate operating parameter adjustment. In another embodiment,the feedback loop 66 may be defined by a human operator (not shown) atthe dispensing system 18 who manually attends to adjusting operatingparameters of the underfill dispensing system 18 based upon filletinformation obtained from the AOI system 19.

In response to the value of the measureable property communicated overthe feedback loop 66, the dispensing system 18 is configured to adjustone or more operating parameters to allow proper dimensioning of thefillet 12 to be maintained. This communication and adjustment suppliesthe closed loop feedback of a closed-loop control system between the AOIsystem 19 and the dispensing system 18. In such a closed-loop controlsystem, the values of the measureable property of the fillet 12 are fedfrom the controller 50 of the AOI system 19 as a reference to thecontroller 36 of the dispensing system 18, which continuously orintermittently adjusts the control input to the material dispensingoperation at the dispensing system 18 as necessary to minimize orregulate the control error. Alternatively, the AOI system 19 maydetermine the adjustment from the measurable attribute and communicatethe adjustment to the dispensing system 18. Based on the feedback fromthe AOI system 19 of the actual performance of the dispensing system 18,the dispensing system 18 may dynamically compensate for disturbances tothe control system that cause changes to the fillet 12, such as changesin shape or dimensions, or that may result in the unwanted formation ofa fillet. One objective of the control system is to maintain thecontrolled process of dispensing the fillet 12 within an acceptableoperating range.

For example, if the fillet 12 is determined to be improperly dimensionedby the AOI system 19, the operating parameters of the dispensing system18 can be adjusted accordingly via the information communicated to thedispensing system 18 over the feedback loop 66. In one specific example,in response to detecting an abnormally small fillet size, thatinformation can be automatically communicated via computer 50 to thedispensing system 18 so that the dispensing device (not shown) canincrease the dispense volume of the fillet material 22, therebyincreasing fillet size. In another example, an out-of-bound measurementcan trigger a process alarm that alerts the human operator that theunderfill dispensing process is out-of-control so that the operation ofthe underfill dispensing system 18 can be manually adjusted to rectifythe condition producing the out-of-bound measurement.

In another example, with corner bond dispensing, it can be desirable formaterial 22 to partially flow under the packaged microelectronic device14 to form corner bonds 28 and no fillet 12, as shown in FIG. 3B.Therefore, formation of fillets 12 in this case may be deleterious.Thus, if the AOI system 19 detects the presence of fillets 12, then thatis an error that is fed back to the dispensing system 18 to reduce theamount of material dispensed, or to heat up the supporting substrate 16,or both, for example, so no fillet 12 forms.

After inspection of the fillet 12, the resulting microelectronicassembly 68 may be unloaded from the AOI system 19 by suitabledownstream equipment 70, such as by an automated unloader or by hand,i.e., manually. Suitable automated loaders and unloaders are availablefrom Asymtek of Carlsbad, Calif. Next, the microelectronic assembly 68may be manually or automatically transported to a curing device 72, suchas a static oven, where the microelectronic assembly 68 with underfillmaterial 22 is placed therein and cured, i.e., finally cross-linked topermanent form. The curing device may be included in the downstreamequipment 70. After curing, the microelectronic assembly 68 can befurther subjected to additional known processes and techniques,including molding processes, ball placement processes, componentsingulation, etc.

Accordingly, an improved system 10 and method for inspecting andcontrolling fillet formation is provided that overcomes the drawbacks ofconventional fillet inspection systems and processes. To that end, theautomated system 10 and method of the embodiments of the presentinvention provides fast, reliable, consistent and repeatable inspectionresults. Also, underfill consistency may be improved by being able tocontinuously adjust the operating parameters of the dispensing system 18in real-time, without human intervention. Thus, product yield can beincreased by reducing out-of-specification assemblies. And, anyout-of-control situation can be quickly detected, the dispensing processstopped and/or adjusted, and either human intervention or automatedadjustments relied on to correct the problem. In addition, theinspection process has improved traceability. For example, the board'sserial number, its inspection result, and the login information of theoperator running the inspection may be tracked. Finally, the AOI system19 can record the size and shape of all fillets 12 on everymicroelectronic assembly 68 processed by the dispensing system 18.

While the present invention has been illustrated by a description ofvarious embodiments and while these embodiments have been described inconsiderable detail, it is not the intention of the applicant torestrict or in any way limit the scope of the appended claims to suchdetail. Additional advantages and modifications will readily appear tothose skilled in the art. Thus, the invention in its broader aspects istherefore not limited to the specific details, representative apparatusand method, and illustrative example shown and described. Accordingly,departures may be made from such details without departing from thespirit or scope of applicant's general inventive concept.

What is claimed is:
 1. A method for use in analyzing a materialdispensed onto a supporting substrate, the method comprising: dispensingthe material in a dispensing system onto the supporting substrate; usingan automated optical inspection system to determine a value of ameasurable property of the dispensed material; communicating the valueof the property of the dispensed material from the automated opticalinspection system to the dispensing system; and in response to receivingthe value of the measurable, automatically adjusting an operatingparameter of the dispensing system.
 2. The method of claim 1 whereincommunicating the value of the measurable of the dispensed materialcomprises: communicating the value of the measurable over a feedbackloop connecting a controller at the automated optical inspection systemwith a controller at the dispensing system.
 3. The method of claim 1wherein a packaged microelectronic device is attached to the supportingsubstrate, and adjusting the operating parameter comprises: maintainingproper dimensions of a fillet formed by the material at a peripheraledge of the packaged microelectronic device.
 4. The method of claim 1wherein a packaged microelectronic device is attached to the supportingsubstrate, and adjusting the operating parameter comprises: preventingformation of a fillet by the material at a peripheral edge of thepackaged microelectronic device.
 5. The method of claim 1 wherein usingthe automated optical inspection system to determine the value of themeasurable of the dispensed material comprises: capturing an image ofthe material; and analyzing the image to determine the value of themeasurable.
 6. The method of claim 5 wherein a packaged microelectronicdevice is attached to the supporting substrate, and analyzing the imagecomprises: using an image-processing computer to evaluate one or moredimensions of a fillet formed by the material at a peripheral edge ofthe packaged microelectronic device.
 7. The method of claim 6 furthercomprising: comparing the one or more dimensions of the fillet with adimensional standard to determine whether the fillet is properlydimensioned.
 8. The method of claim 7 further comprising: beforedispensing the material, defining parameters used by theimage-processing computer to determine whether the fillet is properlydimensioned.
 9. The method of claim 6 wherein the fillet defines one ofa no-flow underfill fillet, a corner bond fillet, an edge bond fillet,or a capillary underfill fillet.
 10. The method of claim 1 furthercomprising: transferring the supporting substrate and the dispensedmaterial from the dispensing system to an automated optical inspectionsystem.
 11. The method of claim 10 wherein a packaged microelectronicdevice is attached to the supporting substrate, and transferring thesupporting substrate and the dispensed material from the dispensingsystem to the automated optical inspection system comprises:transferring the supporting substrate, the packaged microelectronicdevice, and the dispensed material as an assembly from the dispensingsystem to the automated optical inspection system.
 12. The method ofclaim 10 wherein a packaged microelectronic device is attached to thesupporting substrate, and dispensing the material in a dispensing systemonto the supporting substrate comprises: dispensing the material ontothe supporting substrate adjacent to a peripheral edge or a corner ofthe packaged microelectronic device.
 13. An automated system for use inanalyzing a material dispensed onto a supporting substrate, the systemcomprising: a dispensing system including a dispensing device configuredto dispense the material onto the supporting substrate; an automatedoptical inspection system configured to capture an image of the materialdispensed at the peripheral edge of the gap and to analyze the image todetermine a value of the measurable of the dispensed material; and afeedback loop coupling the automated optical inspection system with thedispensing system, wherein the automated optical inspection system isconfigured to communicate the value of the measurable property of thematerial over the feedback loop to the dispensing system.
 14. The systemof claim 13 wherein the automated optical inspection system includes atleast one camera configured to capture the image, and a controllercoupled with the camera, the camera being adapted to communicate theimage to the controller, and the controller configured to analyze theimage for determining the value of the measurable of the material. 15.The system of claim 14 further comprising: a conveyor sub-system adaptedto convey and hold the supporting substrate; and a transport mechanismconfigured to move the camera relative to the supporting substrate. 16.The system of claim 13 wherein the material is dispensed at a peripheraledge of a packaged microelectronic device attached to the supportingsubstrate and separated from the supporting substrate by a gap, andfurther comprising: a loader configured for loading the packagedmicroelectronic device and the supporting substrate into the dispensingsystem, and an unloader configured for unloading an assembly of thepackaged microelectronic device, the supporting substrate, and thematerial dispensed at the peripheral edge of the packagedmicroelectronic device from the automated optical inspection system. 17.The system of claim 13 further comprising: a curing oven downstream ofthe automated optical inspection system, the curing oven configured forcuring the fillet material.
 18. The system of claim 13 wherein thedispensing system and the automated optical inspection system define anisland of automation automated system.
 19. The system of claim 13wherein the dispensing system and the automated optical inspectionsystem define an inline automated system.
 20. The system of claim 13wherein the dispensing system includes a controller coupled incommunication with the dispensing device, the controller configured tosupply control signals to the dispensing device for controlling thedispensing of the material onto the supporting substrate, and theautomated optical inspection system includes a camera and a controllercoupled in communication with the camera and by the feedback loop withthe controller of the dispensing system, the camera configured tocapture the image of the material dispensed at the peripheral edge ofthe gap and the controller to analyze the image to determine a value ofthe measurable property of the dispensed material.